For 20 years, our Teledyne AnaFocus team has partnered with a fast growing portfolio of new customers to co-develop a range of truly innovative custom CMOS image sensors.
Teledyne AnaFocus image sensors are tailored to optimally solve specific customer application challenges with 95% of projects successful in their first silicon (an unprecedented industry track record).
Ultra-high speed image sensors, delivering millions of frames per second.
Ultra-low noise, high sensitivity sensors with specifications rivalling EMCCDs.
3D sensors which improve the speed and accuracy of pre-existing solutions.
High-sensitivity, low-noise time-of-flight sensors with automotive and industrial grade.
Highly integrated vision sensors for industrial use.
Line scan solutions with performance comparable to TDI CCDs.
From standard to fully custom products, to fit all of your needs.
1D
2D
3D
Design and Production Capabilities
From wafers to integrated systems 65nm, 180nm fab processes
Supply Chain
From hundreds to
> 2 million units a year
Image Sensor Size
Linear up to 32K
Area up to 67M
Pixel Pitch
From 1.12 µm to 10 x 200 µm
Speed
From 30 to 3 million fps
Spectral Range
From X-ray, visible to NIR*
*NIR: a unique photodiode and process exclusive to Teledyne e2v
Shuttering Modes
3T, 4T, 5T, 6T and rolling or global shutter
Sensor Packing Options
CLCC, PGA, COB, (CSP, Fan-out)
Interfaces: From Sensor to Sub-system
SP1/12C
USB 2
USB 3
Other Functionalities
Multiple ROI
Binning
Subsampling
Gating for ToF or range gating
Ultra low noise
HDR mode
Single photon sensitivity
FPN & defective pixel correction
Stitching
Low light, BSI