AI-Powered Optical Inspection Can Find Nanoscale PCB Defects
By Bruno Ménard, Software Director, Teledyne DALSA
The size and competitiveness of the mobile phone industry has driven investment and innovation in many industries, from imaging to software to even metallurgy. Few industries have been as affected as the semiconductor market, where demand for higher performance in smaller packages has been unrelenting for few decades. Last month Apple released its latest iPhones, some powered by its new A17 Bionic chips, built on TSMC’s new 3nm manufacturing process. Apple is reportedly buying up everything that TSMC can manage to make. These chips are reportedly smaller, faster, cooler, more power-efficient than their 5nm predecessors. According to Apple, each chip features 19 billion transistors, some so small that their elements are only 12 silicon atoms wide.