Drawing on Teledyne’s four decades of industry leading expertise, the all new Linea™ HS2 camera series represents a significant breakthrough in next generation TDI technology. Designed for ultra-high-speed imaging in light starved conditions, it delivers exceptional image quality with 16k/5 µm resolution and boasts an industry leading maximum line rate of 1 Megahertz, or 16 Gigapixels per second data throughput.
Introducing The Future of Line Scan Imaging
A Seamless Upgrade, Packed with Powerful Features
Linea HS2 offers an easy upgrade from Teledyne’s existing Linea HS line scan cameras, featuring the same pixel size, optics, cables, and mounting hardware, but with a 2.5 time increase in speed, while maintaining reasonable power consumption. The cameras also deliver the highest performance available, with unique features that significantly improve detectability for many demanding applications.
Backside Illumination for Ultra-High-Speed Imaging
Linea HS2 features a highly sensitive Backside Illuminated (BSI) multi-array charge-domain TDI CMOS sensor with 16k/5 µm resolution and optimized Quantum Efficiency, meeting the rigorous demands of current and future machine vision applications. The multi-array TDI sensor architecture allows the camera to be configured for superior image quality with maximized line rate, dynamic range, or full well, according to specific application requirements. On-chip binning also enables higher web speeds to boost system throughput. The camera is equipped with dual Camera Link HS CX4 connectors to Active Optical Cables providing complete EMI immunity.
A Complete Imaging Solution
For a complete solution, the Linea HS2 camera works with Teledyne’s Xtium2 CLHS series of high-performance frame grabbers, utilizing next generation CLHS technology. The Xtium2 CLHS PX8 is built on reliable, field-proven high-speed data transmission technology, delivering data at 16 Gigapixels per second over dual CLHS CX4 connectors to active optical cables. Its data forwarding capability supports parallel data processing in up to 12 PCs and together with Linea HS2, allows for cable lengths over 100 meters with complete EMI immunity.
Typical Applications
The Linea HS2 enables high speed and high sensitivity imaging in light starved conditions, making it particularly idea for:
- Semiconductor wafer inspection
- High density packaging inspection
- Flat panel display inspection
- Gene sequencing
- Digital pathology
If you need maximum throughput in the toughest conditions, you need Linea HS2.
Family Highlights
| Camera Type | TDI Line Scan |
|---|---|
| Sensor Technology | CMOS |
| Supported Interfaces | Camera Link HS |
| Spectrum Capability | Ultraviolet (193-400 nm), Visible (400-700 nm), Near Infrared (700-1000 nm) |
Specifications
Highlighted
- Part Number
- H2-HM-16K100H-00-B
- Resolution
- 16384 x 288 (3 TDI arrays 128 + 128 + 32)
- Max Line Rate
- 1000 kHz
- Pixel Size
- 5
- Sensor Type
- CMOS
- Shutter type
- N/A
- Spectrum
- Mono
- Lens Mount
- M90 x 1 mm
- Synchronization
- Image sync: Free-running, external trigger, CLHS trigger
- Data Interface
- Camera Link HS
- Protection
- IP30
Features
- Acquisition Modes
- Continuous
- Exposure Control
- Hardware trigger, programmable via camera API
- Flash Memory
- Cameras
- Gain Control
- Manual
Performance
- Dynamic Range dB
- 65
- Gain Range
- 1x to 10x
- Peak Wavelength
- 620 nm
- Responsivity
- 700+700+175 (DN8/nJ/cm2)
Physical
- Connector
- CX4 or Hirose 12-pin circular (male)
- Digitization Bit Depth (ADC)
- 8-bit, 10-bit
- Dimensions [W x H x L]
- 97 mm x 180 mm x 76.9 mm
- Mass
- 1.48 kg
- Operating Temperature
- 0°C to 50°C (measured at the front face of the camera)
- Power Consumption [Maximum]
- 56 W
- Power Requirements
- 24 V via GPIO connector
- Storage Humidity
- 15 to 85% (no condensation)
- Storage Temperature
- -20°C to 80°C
Recommended System Configuration
- Port
- CLHS 7 Data Lanes (10.3 Gbps/lane)
Compliance & Certifications
- Compliance
- CE, FCC, KCC, RoHS.
- Machine Vision Standard
- CameraLink HS v1.0
- Warranty
- 3 years
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